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modular and rubber coated heat blocks that can easily be turned on the side to see the exact placement of your chip under the scope
but we do not offer support for installing or using zxw
• Infused with electrically insulating CircuitSheild™ technology
iPhone 12 Pro
EMMC Chip Off Stencil uv modular and rubber coated heatSingle stencil for Direct BGA eMMC eMCP (221 153 169 254 162 186 ) for reballing BGA memory eMMC EMCP chips found in phones and tablets. Specification: Material: Stainless steel Type of stencils: direct heatingApplication: Chip off unencrypted Android mobile devices commonly use chips found in this reballing stencil
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